Superior TIM Solution for high-power density electronics​

Highly flexibility and conform-ability to surface roughness​

Wide operation temperature: -60°C ~ 250°C

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Can be used both in testing environments and in the final, in-field deployment of semiconductor (TIM1 & TIM2)

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GA Series (Graphene with Aluminum Laminate)

• Vertically aligned graphene

• Aluminum laminate protective layer

• Increased durability and reduced marking and marring of device under test

• Thermal Resistance: ≤0.17 Kcm²/W (0.30mm @ 40psi)

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GS Series (Graphene Sheet)

• Vertically aligned graphene

• Low thermal resistance for optimal heat transfer efficiency

• High compressibility with exceptional recovery rate

• Thermal Resistance: ≤0.07 Kcm²/W (0.31mm @ 40psi)